Claims to be Q&A with Huawei advanced packaging tech person jiuyangongshe.com.
Chiplets link entire IC industry chain including chip design, EDA, IP, interposer, material & tools.
Stacked 14nm to get 7nm server cloud CPUs. Use both domestic & foreign EDA. Empyrean still
Chiplets link entire IC industry chain including chip design, EDA, IP, interposer, material & tools.
Stacked 14nm to get 7nm server cloud CPUs. Use both domestic & foreign EDA. Empyrean still
getting tested & qualified. So for now, still reliant on foreign product here. Manufacturer is SMIC.
Die testing can be done, but gap with foreign firms.
Chiplet require more complex testing process.
Sever CPU chiplet before mobile SoC due to size/heat requirement of mobile.
Die testing can be done, but gap with foreign firms.
Chiplet require more complex testing process.
Sever CPU chiplet before mobile SoC due to size/heat requirement of mobile.
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